PECHT, Michael G.

PECHT, Michael G. American, b. 1952. Genres: Sciences. Career: University of Maryland at College Park, professor of mechanical engineering, 1983-, Westinghouse Professor, 1987-88, director of Computer Aided Life Cycle Engineering (CALCE) Electronic Packaging Research Center, 1985-. Air Force Institute of Technology, visiting scholar, 1987. Chief editor, Microelectronics Reliability International, 1996-; associate editor, IEEE Transactions on Electronic Components, Packaging and Manufacturing Technologies, 1995-. Publications: Integrated Circuit, Hybrid, and Multichip Module Package Design Guidelines, 1994; (with P. Lall and E. Hakim) The Influence of Temperature on Microelectronic Device Reliability, 1994. EDITOR: Handbook of Electronic Package Design, 1991; Soldering Processes and Equipment, 1993; Placement and Routing of Electronic Modules, 1993; (with R. Hannemann and A. Kraus) Quality Conformance and Qualification of Electronic Packages, 1994; Reliability Engineering, 1994; (with L. Nguyen and Hakim) Plastic Encapsulated Microelectronics: Materials, Processes, Quality, Reliability, and Applications, 1994; (with D. Bean and Shukla) The Singapore and Malaysia's Electronics Industries, 1997; (with R. Radojcic and G. Rao) Guidebook for Managing Silicon Chip Reliability, 1999. Work represented in anthologies. Contributor to scientific journals. Address: CALCE Electronic Products and Systems Consortium, University of Maryland at College Park, College Park, MD 20742, U.S.A. Online address: [email protected]